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HP-X

HP-X: High-precision surface measurement for every application

HP-X: High-precision surface measurement for every application

Using the innovative measurement method of white light interferometry, surfaces of any kind can be measured in µm resolution, regardless of reflectivity, geometry, material and surface condition. The system uses the interference of light waves for exact, absolute 3D measurement of surfaces of the workpiece to be inspected with the highest precision, thus reliably digitizing and evaluating damage, anomalies or specific surface parameters. Since such a measurement process is required in a wide variety of applications, our HP-X product series focuses on the use of high-precision surface measurement in a wide variety of scenarios. With the product categories “Flexible”, “Stationary”, “Mobile” and “Automatic” we distinguish the degree of automation and the manageability of the respective application. An HP-FX (Flexible), for example, can be used flexibly as a cobot in hand-guided mode or with automatic, predefined measurement sequences to measure defects on components locally. An HP-SX (Stationary), on the other hand, operates in stationary mode and is used for the fully automatic digitization and measurement of small components.

White light interferometer with resolution <1µm
Detachable tablet for direct visualization and viewing of measurement recordings
6-axis robot for easy operation (can be used as a cobot or automatically)

HP-FX – Flexible

White light interferometer with resolution <1µm
Detachable tablet for direct visualization and viewing of measurement recordings
6-axis robot for easy operation (can be used as a cobot or automatically)

The combination of high-precision white-light interferometry and innovative cobot technology enables flexible handling and reliable damage inspection results on any conceivable component!

This makes high-precision digitizing of anomalies and defects a simplicity:

  • Flexible handling and ease of use
  • Hand-guided or automatic execution of measurements on complex components
  • 3D digitization of the component in µm resolution at the push of a button
  • Automatic identification and classification of damage and anomalies

Hand-guided or automatically operable with taught robot paths for repeat measurements.

The HP-FX system can be used to solve a wide range of measurement tasks that require manual and easy handling in combination with highly accurate 3D data. With the HP-FD “DefectMeasurement” system, for example, defects on the component, such as scratches, dents, impacts, cracks or fractures can be measured and digitized locally with µm accuracy. The 3D images of the anomalies are then automatically evaluated, identified and classified to ensure a reliable inspection process. The HP-FC “CoverageCheck” optimizes otherwise manually performed measurement tasks on shot-peened components. The previously individually estimated degree of surface coverage can now be measured with high precision and determined automatically. This procedure increases process reliability and component quality enormously.

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3D Coverage Check

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Defect Measurement

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Whitepaper HP-X EN

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Whitepaper HP-X DE

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White light interferometer with resolution <1µm
Stationary design
Control unit and direct result visualization

HP-SX – Stationary

White light interferometer with resolution <1µm
Stationary design
Control unit and direct result visualization

In the stationary setup, all the strengths of white-light interferometry can be fully exploited. Precise positioning of the sensor and the component by means of high-precision kinematics allows even the smallest components to be completely 3D digitized in µm resolution. The process is fully automatic, whereby the workpiece can be inserted and removed from the measuring device either manually or automatically.

Complete 3D digitization and quality control of smallest components by:

  • White light interferometry with accuracy < 1µm.
  • Intuitive digital 3D result visualization
  • Comprehensive digitization, classification and documentation
  • Customized report generation

Material, exposure and surface independent reliable and highly accurate measurement results.

In addition to the flexible or mobile applications in the HP-X product line, a completely different range of applications can be served in the stationary HP-SX system. Here, the focus is rather on the regular detection of production deviations within an automatic production line. Our HP-ST “ToolInspect” solution is an optical, high-precision measuring system for digitizing milling tools with µm accuracy. Geometry changes, chipping in the material, wear and other individual parameters of the tool are identified by means of the precise 3D digital twin, which solves the previously existing problem of a lack of information density in the production of such a precision tool. Convince yourself of the far-reaching advantages! In the download material you will find more content about the mentioned applications.

Downloads:

Tool Inspection

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Whitepaper HP-X EN

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Whitepaper HP-X DE

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White light interferometer with resolution < 1µm
Precise positioning options
Linear axis for accurate sensor positioning and precise measurements
Mobile placement due to portable design

HP-MX – Mobile

White light interferometer with resolution < 1µm
Precise positioning options
Linear axis for accurate sensor positioning and precise measurements
Mobile placement due to portable design

The mobile application of the HP-X series focuses on the use of high-precision measuring tasks at different locations. The portable product design allows the measuring system to be brought to the workpiece and used there locally. This allows flexible measurement at the required location at any time.

Portable design for use at required location, anytime:

  • Digitization of borehole walls in µm resolution
  • Validation of key parameters such as diameter, angle, roughness
  • Short inspection time for inline process
  • automatic defect detection and quality assessment
  • Increase of machine lifetime due to early defect detection

Material-, surface- and exposure-independent WLI technology combined with 2-axis kinematics and an intuitive user interface gives you the ability to evaluate the quality of a process based on a few key parameters from the measurement while obtaining a full 3D scan of the part. The HP-MB “BoreholeInspection” is a unique solution for high precision measurement and digitization of borehole walls and subsequent defect detection. The application of our solution within the drilling process enables the early detection of system or tool faults and thus increases process efficiency.

Downloads:

Borehole Inspection

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Tool Inspection

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Download Whitepaper HP-X EN

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Whitepaper HP-X DE

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Ergonomically and clearly designed operator terminal
Multi-robot inspection cells
Multi-robot inspection cells
Intricate unit design with vibration decoupling for application on the shop floor

HP-AX – Automatic

Ergonomically and clearly designed operator terminal
Multi-robot inspection cells
Multi-robot inspection cells
Intricate unit design with vibration decoupling for application on the shop floor

The “Automatic Line” HP-AX was developed for large components. By using industrial robots with a large work envelope and additional external axes, even large components can be completely digitized and inspected in µm resolution at the touch of a button. This approach also allows the use of a work tool changer so that multiple tools can be used. The HP-AX systems are delivered enclosed and with an intuitive user interface and can also be used in the workshop due to active vibration decoupling.

Fully automated inspection at the touch of a button

  • Inspection of large components in µm resolution
  • 24 hours operation
  • Recording, processing, interpretation and documentation using 3D.OS
  • Regular automatic re-calibration and gauge validation

Convince yourself of the extensive functions!

High Precision Surface Inspection

High Precision Surface Inspection

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High Precision Surface Inspection

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Whitepaper HP-X EN

Download Whitepaper HP-X EN

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Whitepaper HP-X DE

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